PRIME X670E-PRO WIFI
ASUS PRIME X670E-PRO WIFI, an AMD X670E Ryzen AM5 ATX motherboard with PCIe 5.0, four M.2 slots, DDR5 slots, USB 3.2 Gen 2x2 Type-C, USB4 support, WIFI 6E, and 2.5G Ethernet
• AMD AM5 socket: Ready for AMD Ryzen 7000 series desktop processors
• Enhanced power solution: 14+2 teamed power stages, ProCool sockets, alloy chokes and durable capacitors for stable power delivery
• Next-gen connectivity: PCIe 5.0, USB 3.2 Gen2x2 Type-C, front USB 3.2 Gen 2 Type-C, USB4 support, WiFi 6E, Realtek 2.5 Gb Ethernet, and LANGuard
• Exclusive overclocking technology: AI Overclocking, Dynamic OC Switcher, and Core Flex
• Comprehensive cooling: Large VRM heatsinks, M.2 heatsinks, PCIe Slot Q-Release, M.2 Q-Latch, BIOS FlashBack, hybrid fan headers and Fan Xpert 4 with AI Cooling II
• Two-way AI Noise Cancelation: Reduces background noise from the microphone and audio output for crystal-clear communication in games or video conferences
PCIe 5.0 Slot
PCIe 5.0 offers twice the data transfer speed of PCIe 4.0, making it robust enough to handle new data-heavy tasks. PCIe 5.0 also brings other benefits, such as electrical changes to improve signal integrity, backward-compatible CEM connectors for add-in cards, and compatibility with previous versions of PCI Express.
Four M.2 Slots (with PCIe 5.0)
Four M.2 slots support up to the 22110 device and also can provide NVMe SSD RAID for incredible performance potential. Moreover, one M.2 slot supports PCIe 5.0 with data transfer speeds of up to 128 Gbps, enabling quicker operating system boot-up and file management.
*Actual transmission speeds will be lower than the theoretical maximum speed.
M.2 Heatsinks
Three M.2 heatsinks cover four M.2 slots, warding off throttling that can occur with M.2 storage during sustained transfers.
*Removable captive screws reduce risk of drops or loss during heatsink removal.
VRM Heatsink and Thermal Pads
The two VRM heatsinks on PRIME X670E-PRO WIFI are significantly larger than those found on earlier X570 motherboards. Together with the thermal pads, they improve heat transfer from the MOSFETs and chokes for better cooling performance.
Robust Power Design
Stable power is essential to extract every last bit of performance out of AMD processors. The PRIME X670E-PRO WIFI is geared to cater to the demands of these high-core-count CPUs.
1. ProCool Connectors
Proprietary connectors augment the motherboard's link to the PSU with 8+8 pin connectors that pass 12 volts of power directly to the processors. Each jack features solid pins that can handle more current than hollow-pin connectors.
2. 14+2 Teamed Power Stages
14+2 power stages combine high-side and low-side MOSFETS and drivers into packages rated for 70 amperes each, delivering power, efficiency, stability and performance to latest AMD processors.
USB 3.2 Gen 2x2 Type-C
A batch of USB ports support high-end rigs loaded with peripherals, including both front and rear USB Type-C connectors with ultrafast USB 3.2 Gen 2x2 for transmission speeds of up to 20 Gbps.
WIFI 6E
Onboard WiFi 6E technology takes advantage of the newly available radio spectrum in the 6 GHz band. It provides up to three times the bandwidth of the 5 GHz band and up to seven 160 MHz bands to deliver ultrafast wireless networking speeds and improved capacity as well as better performance in dense wireless environments.
PCIe Slot Q-Release
A physical button located on the chipset heatsink unlocks the first PCIe slot’s security latch with one press, greatly simplifying the process of detaching a PCIe card from the motherboard when it’s time to upgrade to a new GPU or other compatible device.
Q-Latch
The innovative Q-Latch makes it easy to install or remove an M.2 SSD without the need for specific tools. The design employs a simple locking mechanism to secure the drive and neatly eliminate traditional screws.