Thermal Pad 2.0 mm
Cooling Versatility Anywhere
Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces. The Thermal Pad can be cut to size perfect for any application, making it extremely convenient, simple, and versatile.
Formulated with Nano Elements
Versatile and Easy Application
Wide Range of Application
Non-Toxic and Non-Corrosive
Double-Sided Adhesive
2.0 mm Thickness
Wide Range of Application
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard and Disk Drives, IGBT module), laptops, and various products requiring cooling.
Double-Sided Adhesive
Provides seamless and secure contact between surfaces.
Non-Toxic and Non-Corrosive
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.