Excellent performance comes from its first-class data, thermal conductivity up to 14W/m.k, it has a good record of high cooling performance.

The surfaces of processor chips and cooler floors are covered with microscopic dents; ARCTIC‘s MX-4 is composed of carbon microparticles which fill these cavities.

Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without t...

Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces.

Gelid Solutions’ thermal pads are created to provide an excellent thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces.

Gelid Extreme Thermal Pads are designed to provide perfect thermal contact to the heatsink when installed on PCBs with height differences and uneven surfaces.

Created for Extreme Users on highest level the GC-Extreme thermal compound achieves the best heat conductivity from your CPU, VGA or even Chipset to your cooler.

Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience.

Gelid Ultimate is designed to provide perfect thermal contact to heatsinks when installed on PCB with height differences and uneven surfaces.

The Cooler Master Thermal Pad Pro features nano diamond particles for premium thermal conductivity (15.3 W/mK) to help rapidly cool PC components.

Gelid Extreme Thermal Pads are designed to provide perfect thermal contact to the heatsink when installed on PCBs with height differences and uneven surfaces.

CORSAIR XTM50 High Performance Thermal Paste is the most complete solution to help lower your PC component temperatures and keep your PC cool under pressure.

With its improved composition, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The basis for calculation is the temperature difference between the cooler base and the heat source (in C) in relation to the applied heat load (in W), which also results in the unit C/W.

Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites.

Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience.

Gelid Solutions’ thermal pads are created to provide an excellent thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces.

Gelid Extreme Thermal Pads are designed to provide perfect thermal contact to the heatsink when installed on PCBs with height differences and uneven surfaces.

Gelid Ultimate is designed to provide perfect thermal contact to heatsinks when installed on PCB with height differences and uneven surfaces.

Gelid Extreme Thermal Pads are designed to provide perfect thermal contact to the heatsink when installed on PCBs with height differences and uneven surfaces.

With a thermal conductivity value of 8.5W/mK, N-B Max Pro CPU thermal paste promises extreme heat transfer, ensures stability required, helps the system run smoothly.
Electrically insulative
Density of 3.73g/cm³
Operating temperature of -45℃ to +180℃
Won't dry for four years after application

Gelid Ultimate is designed to provide perfect thermal contact to heatsinks when installed on PCB with height differences and uneven surfaces.