Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without t...

Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces.

Excellent performance comes from its first-class data, thermal conductivity up to 9.5w/m.k, it has a good record of high cooling performance.

Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without t...

Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces.

Baraf is a high-performance thermal paste that enhances the efficiency of heat conduction. Easy to apply and perfectly fills the space between your cooler and CPU.

Excellent performance comes from its first-class data, thermal conductivity up to 12.8w/m.k, it has a good record of high cooling performance.

Excellent performance comes from its first-class data, thermal conductivity up to 14W/m.k, it has a good record of high cooling performance.

Heat dissipation paste has good thermal conductivity, which can effectively transfer heat to the heat sink and keep the CPU running at a low temperature.

Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without t...

Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces.

Created for Extreme Users on highest level the GC-Extreme thermal compound achieves the best heat conductivity from your CPU, VGA or even Chipset to your cooler.

The Kryonaut thermal paste was specially developed for the extremely demanding applications and the highest demands of the overlocking community.

Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without t...

Cooler Master’s new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulating properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces.

The Cooler Master Thermal Pad Pro features nano diamond particles for premium thermal conductivity (15.3 W/mK) to help rapidly cool PC components.

The Frost PTM-2 thermal pad, with a perfect replacement for traditional thermal greases, is designed to fill the gap between the contact surface. It can be directly affixed to the CPU/heatsink base without the need to apply, helping efficient heat transfer.

Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience.

CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply.

The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solution.

Excellent performance comes from its first-class data, thermal conductivity up to 14.3W/m.k, it has a good record of high cooling performance.

Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience.

Excellent performance comes from its first-class data, thermal conductivity up to 14W/m.k, it has a good record of high cooling performance.

The surfaces of processor chips and cooler floors are covered with microscopic dents; ARCTIC‘s MX-4 is composed of carbon microparticles which fill these cavities.